Thinvent® Neo H Mini PC, Intel® Core™ i3-1315U processor (6 core, up to 4.5 GHz, 10 MB cache), 8GB DDR4 RAM, 256GB SSD, 12V 7A Adapter, No WiFi, Thinux™ Embedded Linux, DB9 Serial | Neo H Front Horizontal Perspective view
Thinvent® Neo H Mini PC, Intel® Core™ i3-1315U processor (6 core, up to 4.5 GHz, 10 MB cache), 8GB DDR4 RAM, 256GB SSD, 12V 7A Adapter, No WiFi, Thinux™ Embedded Linux, DB9 Serial | Neo H Front Horizontal Perspective view
Thinvent® Neo H Mini PC, Intel® Core™ i3-1315U processor (6 core, up to 4.5 GHz, 10 MB cache), 8GB DDR4 RAM, 256GB SSD, 12V 7A Adapter, No WiFi, Thinux™ Embedded Linux, DB9 Serial | Neo H Front Horizontal view

Thinvent® Neo H Mini PC, Intel® Core™ i3-1315U processor (6 core, up to 4.5 GHz, 10 MB cache), 8GB DDR4 RAM, 256GB SSD, 12V 7A Adapter, No WiFi, Thinux™ Embedded Linux, DB9 Serial

SKU: H-i3_13-8-m256-12_7-X-Thinux-1S

Precision Performance, Industrial Strength: Thinvent® Neo H Mini PC.

Download datasheet
Specifications
Processing
Cores 6
Max Frequency 4.5 GHz
Cache 10 MB
Main Memory 8 GB
SSD Storage 256 GB
Display
HDMI 1
VGA 1
Audio
Speaker Out 1
Mic In 1
Connectivity
USB 3.2 2
USB 2.0 2
Serial Port 1 DB9 male RS232
Networking
Ethernet 1000 Mbps
Power
DC Voltage 12 Volts
DC Current 7 Amps
Power Input 100~275 Volts AC, 50~60 Hz, 1.5 Amps maximum
Cable Length 2 Metre
Environmental
Operating Temperature 0°C ~ 40°C
Operating Humidity 20% ~ 80% RH, non condensing
Certifications BIS, RoHS, ISO
Physical
Dimensions 210mm × 202mm × 80mm
Housing Material Steel
Housing Finish Power Coating
Housing Colour Black
Operating System
Operating System Thinvent® Thinux™ Embedded Linux
OS Features
  • Chromium and Mozilla Firefox browsers.
  • RDP 10 (RemoteFX, H.264/AVC), Putty and SSH for remote display.
  • Browser based remote management. VNC shadowing.
  • Java, Python and glibc based location application support.
  • LibreOffice and PDF viewer.
  • Multimedia player with MPEG4 support.
  • SIP video and voice over IP.

Introducing the Thinvent® Neo H Mini PC, the high-performance evolution of our bestselling Neo series. This isn't just a mini PC; it's an industrial workhorse, meticulously 100% designed and made in India, engineered for demanding applications like industrial control and beyond. Its robust, solid steel build ensures unparalleled durability in challenging environments.

Unrivaled Power and Storage
  • Powered by the Intel® Core™ i3-1315U processor with 6 cores and a max frequency of 4.5 GHz, complemented by 10 MB cache, the Neo H delivers blazing speed for complex computations.
  • Experience seamless multitasking and rapid data access with 16GB DDR4 RAM and a colossal 1TB SSD, providing ample storage for critical data and applications.

Built for Connectivity and Control
  • The Neo H is an industrial workhorse, boasting a DB9 serial port for legacy device integration, crucial for industrial automation.
  • Extensive connectivity includes 2x USB 3.2, 2x USB 2.0, Gigabit Ethernet, HDMI, and VGA outputs for versatile display configurations.
  • Designed for unwavering stability, it focuses on reliable wired Ethernet connectivity, making it ideal for secure and consistent network integration.

Thinvent® Thinux™ Embedded Linux
  • Experience a secure and versatile operating environment tailored for embedded applications.
  • Key features for remote management and productivity:

- Chromium and Mozilla Firefox browsers

- RDP 10 (RemoteFX, H.264/AVC), Putty, and SSH for secure remote display

- Browser-based remote management and VNC shadowing

- Support for Java, Python, and glibc based location applications

- LibreOffice, PDF viewer, and multimedia player with MPEG4 support

- SIP video and voice over IP

Industrial Grade Reliability
  • Built to operate in temperatures from 0°C to 40°C with 20% to 80% non-condensing humidity.
  • Certified with BIS, RoHS, and ISO, guaranteeing quality and compliance.
  • A wide 100~275 Volts AC input range with a robust 12V 7A adapter ensures stable power delivery.

The Thinvent® Neo H Mini PC is your solution for high-performance, rock-solid reliability in critical industrial and embedded applications.