Best Mini PC for SOLIDWORKS
SOLIDWORKS runs best on a mini PC with a multi-core Intel Core or AMD Ryzen processor, at least 16GB of RAM, and an SSD for fast model loading. The Thinvent range includes several models that meet these needs. The most capable options are the Aero Mini PC with Intel Core 5 120U, the Aero Mini PC with Intel Core i7-1255U, and the Aero Mini PC with Intel Core Ultra 5 125U. Each of these has 10 to 12 cores and 16GB of RAM.
Key Specifications for SOLIDWORKS
SOLIDWORKS depends on core count, clock speed, memory capacity and storage speed. The table below compares the Thinvent models in the range that suit this workload.
| Model | Processor | Cores | Max Frequency | Cache | RAM | Storage |
|---|---|---|---|---|---|---|
| Aero Mini PC | Intel Core 5 120U | 10 | 5.0 GHz | 12 MB | 16GB DDR4 | 512GB SSD |
| Aero Mini PC | Intel Core i7-1255U | 10 | 4.7 GHz | 12 MB | 16GB DDR4 | 256GB SSD |
| Aero Mini PC | Intel Core Ultra 5 125U | 12 | 4.3 GHz | 12 MB | 16GB DDR5 | 256GB SSD |
| Aero Mini PC | Intel Core i5-1335U | 10 | 4.6 GHz | 12 MB | 16GB DDR4 | 512GB SSD |
| Treo Mini PC | AMD Ryzen 5 7430U | 6 | 4.3 GHz | 16 MB | 16GB DDR4 | 512GB SSD |
The Intel Core 5 120U has the highest maximum frequency in this group, at 5.0 GHz. The Intel Core Ultra 5 125U has the most cores, at 12. The AMD Ryzen 5 7430U has 6 cores and the largest cache, at 16 MB.
Use Cases
Mini PCs in the Thinvent range suit SOLIDWORKS users who need a compact workstation. Models with 16GB of RAM and 10 or more cores handle assemblies and part modelling. Models with 8GB of RAM or fewer cores suit lighter drafting and simple part work.
The Aero Mini PC models with Windows 11 Pro support SOLIDWORKS directly. Thinvent also has Aero and Treo models with Ubuntu Linux for other engineering software.
Thinvent Mini PCs for SOLIDWORKS
Thinvent has Aero and Treo mini PCs with Intel Core and AMD Ryzen processors. The Aero Mini PC with Intel Core 5 120U, Core i7-1255U and Core Ultra 5 125U are the strongest choices for SOLIDWORKS in the range.
