What the Intel Q670 Chipset Is
The Intel Q670 is a chipset for Intel's Alder Lake platform. It uses the LGA 1700 socket and was released in January 2022. The chipset has up to 24 PCI Express lanes, 8 SATA ports and 4 USB 3.2 Gen 2x2 (20 Gbit/s) ports. It has a maximum TDP of 6 W and a DMI 4.0 interface. It supports PCIe 4.0 and 3.0.
Key Specifications
| Feature | Intel Q670 |
|---|---|
| Platform | Intel Alder Lake |
| Socket | LGA 1700 |
| Release | January 2022 |
| PCI Express lanes | Up to 24 |
| PCIe support | 4.0 and 3.0 |
| SATA ports | 8 |
| USB | 4 x USB 3.2 Gen 2x2 (20 Gbit/s) |
| Maximum TDP | 6 W |
| Interface | DMI 4.0 |
| Package size | 28 mm x 25 mm |
The Q670 integrates the Wi-Fi 6E standard. It does not support overclocking.
Use Cases
The Q670 is a business-class chipset. It suits business desktops, workstations and industrial systems that need many storage ports, PCIe expansion and wired or wireless networking. Its feature set targets managed fleets and systems that run for long periods.
Thinvent Systems Featuring Alder Lake and 12th Gen Intel Core Processors
The Thinvent range does not include systems built on the Intel Q670 chipset. Thinvent systems use 11th, 12th, 13th and 14th Gen Intel processors, including Core i3, i5, i7, Core 5 and Celeron N5095A. Models include the Thinvent Industrial PC IPC5, Industrial PC IPC3, Aero Mini PC and Treo Mini PC. Options include dual LAN, Dual Band WiFi, 16GB to 64GB DDR4 memory, and 128GB to 1TB SSD storage, with Windows 11 Pro, Windows 11 IoT Value or Ubuntu Linux.
