What Is Samsung eMCP?
Samsung eMCP (embedded Multi‑Chip Package) integrates NAND flash storage and LPDDR memory into a single compact package. It is designed for space‑constrained devices such as smartphones, tablets, and some embedded systems, where board space is at a premium. eMCP offers the same functionality as separate discrete memory and storage components but in a smaller footprint, reducing design complexity and power consumption.
Key Technical Details
Samsung eMCP packages combine:
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LPDDR4/LPDDR4X (or earlier LPDDR3) for main memory
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eMMC 5.1 for non‑volatile storage (typically 32 GB, 64 GB, 128 GB)
The package is soldered directly onto the PCB and cannot be upgraded. Common Samsung eMCP part numbers start with KM (e.g., KM3V7001CM). Performance is similar to equivalent discrete components, with eMMC 5.1 offering sequential read speeds up to 320 MB/s and LPDDR4X offering low‑power high‑bandwidth operation.
Comparison With Standard PC Memory & Storage
| Feature | Samsung eMCP | Typical Thinvent Mini PC (e.g., Aero N100) |
|---|---|---|
| Memory | LPDDR4/LPDDR4X (on‑package) | DDR4/DDR5 SODIMM (upgradeable) |
| Storage | eMMC 5.1 (on‑package) | M.2 SSD (SATA or NVMe, upgradeable) |
| Maximum Capacity | Up to 128 GB (storage) | Up to 2 TB+ (storage) |
| Upgradeability | Non‑upgradeable | Fully upgradeable (RAM & SSD) |
| Target Use | Mobile/embedded (handhelds, IoT) | Desktop, thin client, industrial PC |
| Power Efficiency | Very low (optimised for mobile) | Low (fanless designs available) |
Use Cases for Samsung eMCP
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Smartphones & tablets – primary application for eMCP.
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Small‑form‑factor embedded systems – e.g., POS terminals, handheld scanners.
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Single‑board computers – some low‑power SBCs use eMCP for simplicity.
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Legacy device replacement – custom embedded designs that require the same footprint.
Thinvent Products
Thinvent’s range of industrial computers, mini PCs, and thin clients uses modular, upgradeable architecture – standard DDR SO‑DIMM slots and M.2 SSDs – which offers greater flexibility and longer service life compared to eMCP‑based designs. For applications that demand high reliability, easy maintenance, and field‑upgradeable memory/storage, Thinvent systems are an ideal alternative to soldered eMCP solutions. All Thinvent models support Windows, Linux,
