Thinvent® جهاز كمبيوتر صناعي IPC1, معالج AMD Ryzen™ 5 7430U (6 نواة, up to 4.3 GHz, 16 MB cache), ذاكرة وصول عشوائي بسعة 32 جيجابايت من نوع DDR4, 256 جيجابايت إس إس دي, محول 19V 3A, واي فاي ثنائي النطاق, Windows 11 IoT Value
SKU: IPC1-r5_7-32-m256-19_3-m-11V-0
Thinvent® IPC1: Rugged Reliability, Silent Performance, Engineered for Industry.
Explore other configurations: 16GB RAM128GB SSD512GB SSDIPC1 Unknown 16GB 256GBIPC1 Unknown 32GB 128GBIPC1 Unknown 32GB 512GB
المواصفات
Processing
| Generation | 7000 Series |
| Series | Ryzen 5 |
| Processor Brand | AMD |
| Processor Model | 7430U |
| Cores | 6 |
| Max Frequency | 4.3 GHz |
| Cache | 16 MB |
| Main Memory | 32 GB |
| SSD Storage | 256 GB |
Display
| HDMI | 1 |
| VGA | 1 |
Audio
| Speaker Out | 1 |
| Mic In | 1 |
| Front Speaker Out | 1 |
| Front Mic In | 1 |
Connectivity
| USB 3.2 Gen 1 | 2 |
| USB 2.0 | 2 |
| Front USB 2.0 | 4 |
Networking
| Ethernet | 1000 Mbps |
| Wireless Networking | Wi-Fi 5 (802.11ac), dual band |
Power
| DC Voltage | 19 Volts |
| DC Current | 3 Amps |
| Power Input | 100~240 Volts AC, 50~60 Hz, 1.5 Amps maximum |
| Cable Length | 2 Metre |
Environmental
| Operating Temperature | 0°C ~ 40°C |
| Operating Humidity | 20% ~ 80% RH, non condensing |
| Certifications | BIS, RoHS, ISO |
Physical
| Form Factor | Industrial PC |
| Thermal Design | Fanless Passive Cooling |
| Dimensions | 199.5mm × 181.5mm × 34.5mm |
| Packing Dimensions | 340mm × 235mm × 105mm |
| Housing Material | Aluminium |
| Housing Finish | Powder Coated Base, Anodised Cover |
| Housing Colour | Black |
| Net and Gross Weight | 0.94kg, 1.36kg |
Accessories
| VESA Mount | 1 |
Operating System
| Operating System | Microsoft Windows 11 IoT Enterprise LTSC 2024 Value |
