What Is the H54GE6YRb / H54GE6CYRB Part Number?
The query "h54ge6yrb" refers to the SK hynix H54GE6CYRB family, a series of LPDDR4X SDRAM memory devices supplied in a 200-ball FBGA package. The most widely documented variant, H54GE6CYRBX262N, is a 48 Gbit (6 GB) LPDDR4X die built on SK hynix's advanced low-power DRAM process. These parts are sold as bare memory chips to board designers and OEMs rather than as end-user products, which is why they appear mainly on component distributor and broker listings.
Key Specifications
| Attribute | Detail |
|---|---|
| Memory type | LPDDR4X SDRAM (low-power DDR4, X = lower I/O voltage) |
| Density | 48 Gbit (6 GB) per device |
| Package | 200-ball FBGA |
| Supplier | SK hynix |
| Typical I/O voltage | 0.6 V (LPDDR4X low-voltage I/O) |
| Target use | Soldered-down, space-constrained embedded designs |
LPDDR4X differs from standard DDR4 in two important ways: it uses a much lower I/O voltage to cut power consumption, and it is designed to be soldered directly onto the board (memory-down) rather than fitted into a DIMM socket. That makes it the memory of choice for fanless industrial computers, mini PCs, thin clients, and handheld devices where every milliwatt and every millimetre counts.
Where LPDDR4X Memory Is Used
Because LPDDR4X is memory-down, it is chosen at the design stage and cannot be upgraded later. Engineers select it for:
-
Fanless industrial PCs and mini PCs that must run cool and draw minimal power in sealed enclosures.
-
Thin clients and all-in-one terminals where a slim, low-profile board is required.
-
Edge and IoT gateways running continuously on modest power budgets.
-
Handheld and battery-powered instruments where low standby current matters.
The trade-off is clear: LPDDR4X gives excellent power efficiency and a compact footprint, but capacity is fixed at build time. Systems that need field-upgradable memory generally use socketed DDR4 SO-DIMMs instead.
Sourcing and Compatibility Notes
Component listings for the H54GE6CYRB series appear across distributor and broker sites, and stock availability for individual density and speed grades varies over time. When validating a substitute or alternative LPDDR4X part, confirm the density, package ball count, speed grade, and operating temperature range against the original datasheet, and verify that the memory controller on your SoC or chipset officially supports that configuration. Substituting a different density or ball-out without checking these parameters can cause training failures at boot.
Thinvent Products Featuring This Technology
Thinvent builds industrial computers, mini PCs, thin clients and all-in-one PCs around low-power, memory-down architectures suited to fanless operation. Our platforms are engineered for continuous duty in dusty, hot and vibration-prone environments, with a choice of Intel processors, soldered or socketed memory configurations, and operating systems ranging from Windows 11 Pro and IoT editions to Ubuntu Linux, Thinux Embedded Linux, FreeDOS and no-OS builds. If you are designing a system around LPDDR4X-class memory or need a compact, reliable computing platform for an embedded deployment, our team can help you match the right form factor and configuration to your application.
