Icop Pc104 - PC/104 Embedded Computing Solutions Guide

What is PC/104?

PC/104 is a standardized, compact, and rugged form factor for embedded computing systems. It defines a stackable, modular architecture where boards are connected via a 104-pin connector, eliminating the need for a traditional motherboard and backplane. This design is renowned for its high reliability, low power consumption, and exceptional resistance to shock and vibration, making it ideal for space-constrained and harsh industrial environments.

Key Specifications and Technical Details

The PC/104 standard specifies a board size of 3.550 x 3.775 inches (90 x 96 mm). Its defining feature is the self-stacking bus, which uses reliable pin-and-socket connectors. Key technical aspects include:

  • Form Factor: Extremely compact and stackable.

  • Bus Interface: Originally based on the ISA bus, with evolved standards like PC/104-Plus (adding PCI) and PCI/104-Express (adding PCIe).

  • Ruggedness: Designed for extended temperature ranges and high mechanical stress.

  • Power: Typically operates on +5V DC, with low overall power draw.

  • Expansion: Modules for CPU, I/O, networking, and data acquisition can be stacked to create a custom system.

Applications and Use Cases

PC/104 systems are deployed where reliability and size are critical. Common applications include:

  • Industrial Automation & Control: Machine control, PLCs, and robotics.

  • Transportation: Railway, aviation, and automotive telematics and control systems.

  • Military & Aerospace: Ruggedized computing for field deployments and avionics.

  • Medical Devices: Imaging systems and portable diagnostic equipment.

  • Digital Signage & Kiosks: Reliable operation in public spaces.

PC/104 vs. Modern Compact Form Factors

While PC/104 excels in ultra-rugged, modular applications, modern industrial systems often use more integrated, cost-effective form factors for many use cases.

Feature Traditional PC/104 Modern Industrial Mini PC
Form Factor Stackable modules (90mm x 96mm) Integrated, sealed chassis
Ruggedness Excellent (designed for harsh env.) Very Good (fanless, wide temp.)
Performance Varies by module; can be limited Typically higher, modern CPUs
Deployment Custom stack assembly Plug-and-play, pre-configured
I/O Flexibility High (modular expansion) Fixed, but commonly sufficient
Total Cost Higher (modules, assembly) Often lower

Thinvent Solutions for Embedded Applications

While Thinvent specializes in pre-integrated, fanless industrial computers, our product philosophy aligns with the core needs of PC/104 users: reliability, compact size, and industrial durability. Our systems offer a compelling alternative for applications where a fully integrated, lower-maintenance solution is preferred. Thinvent's range of Industrial PCs and Mini PCs feature:

  • Fanless, Sealed Designs: For dust and vibration resistance.

  • Wide Temperature Operation: Suitable for challenging environments.

  • Rich Industrial I/O: Including multiple Ethernet, USB, COM, and display ports.

  • Modern Processing Power: Utilizing efficient Intel processors for robust performance.

  • Flexible OS Support: From Windows IoT and Linux to headless configurations.

For engineers seeking the reliability ethos of embedded systems with the simplicity and power of a modern integrated computer, Thinvent's products provide a robust and ready-to-deploy solution.

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